Expanded density coverage enables broader customer design opportunities across DDR4 and LPDDR4 applications

TAICHUNG, Taiwan, Nov. 4, 2026 /PRNewswire/ — Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the expansion of its 16nm DRAM portfolio with new 8Gb LPDDR4 (x16), 16Gb LPDDR4 (x32), and 16Gb DDR4 products, strengthening its density coverage and enabling customers to address a broader range of system and product requirements.

As operating systems and applications continue to evolve, systems process more data and require memory configurations tailored to different performance and cost requirements. At the same time, customers increasingly offer multiple product tiers—from entry-level to high-end and flagship models—each requiring different memory densities. A broader range of DRAM densities therefore gives system designers greater flexibility to select the memory configuration that best fits each product.

The expansion of Winbond’s 16nm DRAM portfolio addresses this need by filling existing density gaps in its DDR4 and LPDDR4 offerings. The 16Gb devices can deliver twice the density per device compared with 8Gb solutions, enabling customers to achieve the same memory capacity with fewer components and potentially reduce board space. More complete density coverage also allows Winbond to support a broader range of products within the same customer product family, helping customers consider Winbond solutions across different design requirements.

The new 16Gb DDR4 products are designed to support applications including switches and server peripherals, while the new 16Gb LPDDR4 products target applications such as automotive systems and AI image signal processing (AI-ISP) applications, including drones and surveillance systems.

“The expansion of our 16nm DRAM portfolio is an important step toward providing customers with more complete density coverage,” said Winbond. “Customers increasingly need different memory configurations across product tiers and applications. By expanding our DDR4 and LPDDR4 portfolio, we can support a broader range of customer products and provide greater flexibility during the design-in process.”

Winbond’s 16nm DRAM platform is designed to provide low power consumption and stable high-speed performance, while its advanced process technology enables Winbond to increase the number of memory units produced from available wafer capacity. The expanded portfolio further strengthens the company’s ability to serve customers seeking established DDR4 and LPDDR4 solutions across a range of applications.

The new 16Gb DDR4 and 16Gb LPDDR4 products are scheduled to become available by the end of 2026, with mass production planned for Q2 2027. With these products, Winbond continues to expand the density coverage of its 16nm DRAM portfolio and strengthens its ability to support customers across different product tiers and application requirements.

About Winbond
Winbond was established in September 1987 and listed on the Taiwan Stock Exchange in 1995. The company is headquartered at the Central Taiwan Science Park (CTSP) in Taichung, Taiwan, and operates two highly automated and intelligent 12-inch wafer fabs in Taichung and Kaohsiung. Winbond is committed to providing comprehensive integrated circuit solutions to customers worldwide, with major product lines including Code Storage Flash, Customized Memory Solution (CMS), and various logic IC solutions.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Contact:
Nicole Conley
Tanis Communications for Winbond
831-713-9076
nicole.conley@taniscomm.com

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SOURCE Winbond Electronics Corporation